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Sensors (Basel, Switzerland)|August 12, 2022
Development of a Reliable High-Performance WLP for a SAW DeviceZuohuan Chen, Daquan YuSensors (Basel, Switzerland)|March 26, 2022
Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF FilterZuohuan Chen, Daquan Yu, Yi ZhongMicromachines|October 27, 2022
Thermo-Mechanical Reliability Study of Through Glass Vias in 3D InterconnectionJin Zhao, Zuohuan Chen, Fei Qin, et al.Fundamental Research|December 30, 2024
A high-efficiency transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packagingLin Cheng, Zuohuan Chen, Daquan Yu, et al.Micromachines|September 27, 2025
Heterogeneous Integration Technology Drives the Evolution of Co-Packaged OpticsHan Gao, Wanyi Yan, Dan Zhang, et al.Sensors (Basel, Switzerland)|July 26, 2020
Development of Reliable, High Performance WLCSP for BSI CMOS Image Sensor for Automotive ApplicationTianshen Zhou, Shuying Ma, Daquan Yu, et al.Micromachines|March 27, 2025
A Review of Wafer-Level Packaging Technology for SAW and BAW FiltersXinyue Liu, Wenjiao Pei, Jin Zhao, et al.Microsystems & Nanoengineering|January 12, 2026
Wafer-level self-packaged MEMS infrared emitters with high-emissivity black silicon surfaceZhiwei Li, Hongliang Zu, Hongyu Chen, et al.ACS Applied Materials & Interfaces|December 10, 2025
The Influence of Different Nanoscale Channel Lengths in Low-Temperature-Grown Lateral MoS2 MemristorsDanyun Wang, Daquan Yu, Hongyu Chen, et al.Sensors (Basel, Switzerland)|January 11, 2024
Application of Through Glass Via (TGV) Technology for Sensors Manufacturing and PackagingChen Yu, Shaocheng Wu, Yi Zhong, et al.Pageof 3