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3D Printing and Additive Manufacturing|January 19, 2023
A Radiopaque Nanoparticle-Based Ink Using PolyJet 3D Printing for Medical ApplicationsAlice Shannon, Aine O'Connell, Aidan O'Sullivan, et al.3D Printing and Additive Manufacturing|January 19, 2023
A Method for Calculating the Critical Velocity of Microdroplets Produced by Circular NozzlesJianjun Wang, Jin Huang, Jie Zhang3D Printing and Additive Manufacturing|January 19, 2023
Utilizing Fused Filament Fabrication for Printing Iron Cores for Electrical DevicesYaozhong Zhang, Lucrezia Poli, Elias Garratt, et al.3D Printing and Additive Manufacturing|January 19, 2023
Assessment of Additive Manufacturing for Increasing Sustainability and Productivity of Smallholder AgricultureWenjia Gu, Erika Styger, Derek H Warner3D Printing and Additive Manufacturing|January 19, 2023
Additively Manufactured NdFeB Polyphenylene Sulfide Halbach Magnets to Generate Variable Magnetic Fields for Neutron ReflectometryTej Nath Lamichhane, Timothy R Charlton, Brian Andrews, et al.3D Printing and Additive Manufacturing|January 19, 2023
Micro-Computed Tomography to Assess the Processing Quality of the Additive Manufacturing of Spiral MicrocoilsWenjie Niu, HuaZhi Xiao, Hao Ying, et al.3D Printing and Additive Manufacturing|January 19, 2023
Production of Filter Material from Polypropylene/Copolyamide Blend by Material Extrusion-Based Additive Manufacturing: Role of Production Conditions and ZrO2 NanoparticlesVictor Beloshenko, Vyacheslav Chishko, Viktoria Plavan, et al.3D Printing and Additive Manufacturing|January 19, 2023
Assessing Tetrahedral Lattice Parameters for Engineering Applications Through Finite Element AnalysisUchechukwu O Agwu, Kangchun Wang, Chaitanya Singh, et al.3D Printing and Additive Manufacturing|January 19, 2023
Technological Feasibility of Lattice Materials by Laser-Based Powder Bed Fusion of A357.0Antonella Sola, Silvio Defanti, Sara Mantovani, et al.3D Printing and Additive Manufacturing|May 6, 2017
3D Systems' Technology Overview and New Applications in Manufacturing, Engineering, Science, and EducationTrevor J Snyder, Mike Andrews, Mark Weislogel, et al.Pageof 48