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Advances in Colloid and Interface Science|April 7, 2026
Bulk-to-interface engineering of solid-state electrolytes toward fast-charging Li/Na-ion batteriesLirong Zhang, Tianyun Zhang, Xiangya Wang, et al.
Advances in Colloid and Interface Science|April 3, 2026
Medium/low internal phase Pickering emulsion gels stabilized by biopolymer: Stability mechanism, material design, and applicationKangyu Li, Zong Meng
Advances in Colloid and Interface Science|April 16, 2026
Interfacial functionalization strategies for constructing polymerizable nanomaterials and their polymerized nanohybrid systemsWenjing Zhang, Tiao Feng, Yunfeng Wang, et al.
Advances in Colloid and Interface Science|April 5, 2026
Liposomes: A breakthrough in advanced drug delivery systemsXunan Zhang, Wenjie Liu, Hongtao Chu, et al.
Advances in Colloid and Interface Science|August 7, 2026
Exploring the advancements in HOF based photocatalytic and electrochemical assemblies for remediation and energy related applicationsAman Chauhan, Sheetal Rana, Archana Negi, et al.
Advances in Colloid and Interface Science|July 29, 2026
Advancing hydrogen-bonded organic framework-based composites for integrated catalysis: A review of interface-oriented dual energy conversion and environmental cleanupDong-Eun Lee, Ahmad Husain, Mohtaram Danish, et al.
Advances in Colloid and Interface Science|August 6, 2026
Solvent-engineered hydrogels: A multiscale design framework for bone regenerationRamón Rial, Ali Reza Saremi, Juan M Ruso
Advances in Colloid and Interface Science|August 8, 2026
Emerging hydrogel and hydrogel-derived nanoarchitectonics for photocatalysis and electrocatalysis in sustainable energy and chemical applicationsYimeng Ni, Siew Kheng Boong, Carice Chong, et al.
Advances in Colloid and Interface Science|August 27, 2026
3D bioprinting modalities for tissue engineering and regenerative medicineKannan Badri Narayanan, Sung Soo Han
Advances in Colloid and Interface Science|September 29, 2026
Advanced fruits postharvest coatings/films technologies: from simple matrix restructuring to intelligent microenvironment engineeringJiazhen Wang, Menghuan Sun, Ting Du, et al.
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