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Communications Engineering
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April 21, 2026
Minimizing interface defects and enhancing optical brightness of µLEDs through polymeric encapsulants
Pranav P Gavirneni, William S Wong
Communications Engineering
|
June 3, 2026
Single-Pixel Tactile Skin via compressive sampling
Ariel Slepyan, Laura Xing, Rudy Zhang, et al.
Communications Engineering
|
May 12, 2026
Robust magnetoelectric backscatter communication system for bioelectronic implants
Fatima Alrashdan, Joshua E Woods, Ellie C Chen, et al.
Communications Engineering
|
May 18, 2026
Beyond 350 GHz: Single-channel 112 Gbps photonic wireless transmission at 560 GHz using soliton microcombs
Yu Tokizane, Hiroki Kishikawa, Takumi Kikuhara, et al.
Communications Engineering
|
May 6, 2026
Optimized sensor-embedded loose garment for accurate motion detection
Mohamed Elgendi, Tomasz Raczyński, Alexander Shokurov, et al.
Communications Engineering
|
May 4, 2026
Beam manipulation for terahertz communications
Mingxiang Li, Josep M Jornet, Daniel M Mittleman, et al.
Communications Engineering
|
May 15, 2026
Industry-academia interface: how to build industry-university partnerships with Mark Jefferies
Communications Engineering
|
May 5, 2026
Vat photopolymerization of gel polymer electrolytes with solvent-dependent performance and complex geometries for Li-ion batteries
Alexis Maurel, Katherine R Gonzalez, Hugo A Garcia, et al.
Communications Engineering
|
June 9, 2026
Thermal-mechanical coupling in shale geothermal reservoirs: a framework for temperature-dependent seismic characterization
Qamar Yasin, Ghulam Mohyuddin Sohail, Eshimiakhe Daniel, et al.
Communications Engineering
|
June 15, 2026
Unlocking the Nickel Value of Ultramafic Resources Through Innovative Thermal Treatment Process
Wei Lv, Fanmao Wang, Brian Makuza, et al.
Page
of 48
Search research articles
Search
Showing results (461-470 of 473) with videos related to
Sort By:
Page
of 48
Communications Engineering
|
April 21, 2026
Minimizing interface defects and enhancing optical brightness of µLEDs through polymeric encapsulants
Pranav P Gavirneni, William S Wong
Communications Engineering
|
June 3, 2026
Single-Pixel Tactile Skin via compressive sampling
Ariel Slepyan, Laura Xing, Rudy Zhang, et al.
Communications Engineering
|
May 12, 2026
Robust magnetoelectric backscatter communication system for bioelectronic implants
Fatima Alrashdan, Joshua E Woods, Ellie C Chen, et al.
Communications Engineering
|
May 18, 2026
Beyond 350 GHz: Single-channel 112 Gbps photonic wireless transmission at 560 GHz using soliton microcombs
Yu Tokizane, Hiroki Kishikawa, Takumi Kikuhara, et al.
Communications Engineering
|
May 6, 2026
Optimized sensor-embedded loose garment for accurate motion detection
Mohamed Elgendi, Tomasz Raczyński, Alexander Shokurov, et al.
Communications Engineering
|
May 4, 2026
Beam manipulation for terahertz communications
Mingxiang Li, Josep M Jornet, Daniel M Mittleman, et al.
Communications Engineering
|
May 15, 2026
Industry-academia interface: how to build industry-university partnerships with Mark Jefferies
Communications Engineering
|
May 5, 2026
Vat photopolymerization of gel polymer electrolytes with solvent-dependent performance and complex geometries for Li-ion batteries
Alexis Maurel, Katherine R Gonzalez, Hugo A Garcia, et al.
Communications Engineering
|
June 9, 2026
Thermal-mechanical coupling in shale geothermal reservoirs: a framework for temperature-dependent seismic characterization
Qamar Yasin, Ghulam Mohyuddin Sohail, Eshimiakhe Daniel, et al.
Communications Engineering
|
June 15, 2026
Unlocking the Nickel Value of Ultramafic Resources Through Innovative Thermal Treatment Process
Wei Lv, Fanmao Wang, Brian Makuza, et al.
Page
of 48