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Journal of Materials Science. Materials in Electronics|April 16, 2024
Luminescence properties and energy transfer of Tb3+, Eu3+ co-doped YTaO4 phosphors obtained via sol-gel combustion processShangrui Nan, Feng Hong, Haiping Xu, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Detection of biomolecules in dielectric modulated double metal below ferroelectric layer FET with improved sensitivityYash Pathak, Bansi Dhar Malhotra, Rishu ChaujarJournal of Materials Science. Materials in Electronics|April 16, 2024
Noncontact liquid-solid nanogenerators as self-powered droplet sensorsYi Deng, Guihua Meng, Yanlong Tai, et al.Journal of Materials Science. Materials in Electronics|October 14, 2025
High-quality polycrystalline vanadium dioxide thin films deposited via pulsed laser deposition with high uniformity and consistencyZhixiang Huang, Kyle Laskowski, Sai Rahul Sitaram, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Visible photon avalanche up-conversion of Yb3+ and Ho3+ doped NaBi(WO4)2 phosphors under excitation at 980 nmHaiyue Qian, Tianqing Zhang, Xiliang Jiang, et al.Journal of Materials Science. Materials in Electronics|April 16, 2024
Application of quinoline derivatives in third-generation photovoltaicsGabriela Lewinska, Jerzy Sanetra, Konstanty W MarszalekJournal of Materials Science. Materials in Electronics|April 16, 2024
Electrochemical determination of rutin by using NiFe2O4 nanoparticles-loaded reduced graphene oxideNahid Askari, Navvabeh Salarizadeh, Mohammad Bagher AskariJournal of Materials Science. Materials in Electronics|April 16, 2024
Fabrication of magnetic ZnO/ZnFe2O4/diatomite composites: improved photocatalytic efficiency under visible light irradiationLimei Xue, Ermiao Liang, Jiwen WangJournal of Materials Science. Materials in Electronics|October 9, 2026
Bandgap engineering of tantalum nitride thin films by ion‑assisted magnetron sputtering for advanced electronic and radiation detection applicationsGalina Nagicheva, Mikhail Vostokov, Michaël Chesaux, et al.Journal of Materials Science. Materials in Electronics|June 5, 2025
Effects of Ag and melt undercooling on the microstructure of Sn-Ag solder ballsSihan Sun, Ao Li, Chao Cheng, et al.Pageof 4