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Materials (Basel, Switzerland)|July 9, 2022
Effect and Mechanism of Pitch Coating on the Rate Performance Improvement of Lithium-Ion BatteriesBo-Ra Kim, Ji-Hong Kim, Ji-Sun Im
Materials (Basel, Switzerland)|July 9, 2022
Simultaneously Embedding Indomethacin and Electrodeposition of Polypyrrole on Various CoCr Alloys from Ionic LiquidsFlorentina Golgovici, Florentina Gina Ionascu, Mariana Prodana, et al.
Materials (Basel, Switzerland)|July 9, 2022
Temperature-Responsive Polysaccharide Microparticles Containing Nanoparticles: Release of Multiple Cationic/Anionic CompoundsTakumi Sato, Yoshihiko Murakami
Materials (Basel, Switzerland)|July 9, 2022
Correction: Sýs et al. Bis(2,2'-bipyridil)Copper(II) Chloride Complex: Tyrosinase Biomimetic Catalyst or Redox Mediator? Materials 2021, 14, 113Milan Sýs, Atripan Mukherjee, Granit Jashari, et al.
Materials (Basel, Switzerland)|May 22, 2019
Fabrication of Diamond Submicron Lenses and Cylinders by ICP Etching Technique with SiO2 Balls MaskZongchen Liu, Tian-Fei Zhu, Yan-Feng Wang, et al.
Materials (Basel, Switzerland)|May 22, 2019
Optimization of MBE Growth Conditions of In0.52Al0.48As Waveguide Layers for InGaAs/InAlAs/InP Quantum Cascade LasersPiotr Gutowski, Iwona Sankowska, Tomasz Słupiński, et al.
Materials (Basel, Switzerland)|May 22, 2019
Conical Nanoindentation Allows Azimuthally Independent Hardness Determination in Geological and Biogenic MineralsCorinna F Böhm, Patrick Feldner, Benoit Merle, et al.
Materials (Basel, Switzerland)|May 24, 2019
Effects of Machining Velocity on Ultra-Fine Grained Al 7075 Alloy Produced by Cryogenic Temperature Large Strain Extrusion MachiningXiaolong Yin, Haitao Chen, Wenjun Deng
Materials (Basel, Switzerland)|May 26, 2019
Experimental Study on the Preparation of Recycled Admixtures by Using Construction and Demolition WasteShujun Li, Qiuyi Li, Xiaolong Zhao, et al.
Materials (Basel, Switzerland)|May 26, 2019
Enhancement of Photocatalytic Activity under Visible Light Irradiation via the AgI@TCNQ Core-Shell StructureWanli Xie, Li Liu, Wenquan Cui, et al.
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