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Micromachines|November 27, 2024
A Cross-Scale Electrothermal Co-Simulation Approach for Power MOSFETs at Device-Package-Heatsink-Board LevelsYuxuan Dai, Jiafei Yao, Jing Chen, et al.Micromachines|November 27, 2024
Microfabrication Technologies for Interaction Circuits of THz Vacuum Electronic DevicesXinghui Li, Jinjun FengMicromachines|November 27, 2024
Investigation of an Innovative Roll-to-Plate (R2P) Hot-Embossing Process for Microstructure Arrays of Infrared GlassQinjun Li, Kangsen Li, Jinyu Lv, et al.Micromachines|November 27, 2024
Crack Control in Additive Manufacturing by Leveraging Process Parameters and Lattice DesignJun Hak Lee, Seong Je Park, Jeongho Yang, et al.Micromachines|November 27, 2024
An Image Processing Approach to Quality Control of Drop-on-Demand Electrohydrodynamic (EHD) PrintingYahya Tawhari, Charchit Shukla, Juan RenMicromachines|November 27, 2024
Assessment of the Risk of Crack Formation at a Hybrid Bonding Interface Using Numerical AnalysisXuan-Bach Le, Sung-Hoon ChoaMicromachines|November 27, 2024
Comparison of Interfaces Between In Situ Laser Beam Deposition Forming and Electron Beam Welding for Thick-Walled Titanium Alloy StructuresPingchuan Yang, Fei Li, Zongtao Zhu, et al.Micromachines|November 27, 2024
A High-Performance Micro Differential Pressure SensorXutao Fan, Lei Wang, Songsong ZhangMicromachines|November 27, 2024
Large Range Curvature Measurement Using FBGs in Two-Core Fiber with Protective CoatingRuibin Chen, Lutian Li, Qianqing Yu, et al.Micromachines|November 27, 2024
3D Binder-Free Mo@CoO Electrodes Directly Manufactured in One Step via Electric Discharge Machining for In-Plane Microsupercapacitor ApplicationShunqi Yang, Ri Chen, Fu Huang, et al.Pageof 1,327