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Micromachines|July 29, 2023
Image Processing Approach to Investigate the Correlation between Machining Parameters and Burr Formation in Micro-Milling Processes of Selective-Laser-Melted AISI 316LFatih Akkoyun, Zihni Alp Cevik, Koray Ozsoy, et al.
Micromachines|July 29, 2023
Thermal Management of Microelectronic Devices Using Nanofluid with Metal foam Heat SinkMuhammad Teham Tahir, Shahzaib Anwar, Naseem Ahmad, et al.
Micromachines|July 29, 2023
A Novel Density of States (DOS) for Disordered Organic SemiconductorsDong Qin, Jiezhi Chen, Nianduan Lu
Micromachines|July 29, 2023
Highly Uniform Multi-Layers Reduced Graphene Oxide/Poly-2-aminobenzene-1-thiol Nanocomposite as a Promising Two Electrode Symmetric Supercapacitor under the Effect of Absence and Presence of Porous-Sphere Polypyrrole NanomaterialMohamed Rabia, Asmaa M Elsayed, Ahmed M Salem, et al.
Micromachines|July 29, 2023
Universally Grasping Objects with Granular-Tendon Finger: Principle and DesignVan Pho Nguyen, Sunil Bohra Dhyan, Boon Siew Han, et al.
Micromachines|July 29, 2023
Towards Two-Photon Polymerization-Compatible Diffractive Optics for Micro-Mechanical ApplicationsVictoria Paige Stinson, Uma Subash, Menelaos K Poutous, et al.
Micromachines|July 29, 2023
Generation of Photopolymerized Microparticles Based on PEGDA Hydrogel Using T-Junction Microfluidic Devices: Effect of the Flow RatesGabriela Hinojosa-Ventura, Mario Alberto García-Ramírez, José Manuel Acosta-Cuevas, et al.
Micromachines|July 29, 2023
Wide Dual-Band Circularly Polarized Diecletric Resonator: Innovative Integration of a Single Hybrid Feed and Thin Grounded MetasurfaceArslan Kiyani, Mohsen Asadnia, Syed Muzahir Abbas, et al.
Micromachines|July 29, 2023
Milling Stability Prediction: A New Approach Based on a Composited Newton-Cotes FormulaJunqiang Zheng, Pengfei Ren, Chaofeng Zhou, et al.
Micromachines|July 29, 2023
Investigation of Cutting Force and the Material Removal Mechanism in the Ultrasonic Vibration-Assisted Scratching of 2D-SiCf/SiC CompositesHao Lin, Ming Zhou, Haotao Wang, et al.
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