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Micromachines|October 27, 2026
A -97.2 dB PSR 3.18 ppm/°C Bandgap Voltage Reference with Curvature CompensationHao Wu, Guanghui Shi, Siyan Zhou
Micromachines|October 27, 2026
Matched-Compliance Benchmarking of Perforated and Uniformly Thinned Substrates for Piezoelectric Cantilever Energy HarvestersSaad F Almokmesh, Bashar B Alzuwayer
Micromachines|October 27, 2026
Rapid Sampling of Tomato Juice Using a 3D-Printed Microneedle Assisted by an Unmanned Aerial VehicleWeixin Liu, Tianyu Wang, Jiahua Zhong, et al.
Micromachines|October 27, 2026
Sessile Droplet Profiles and Apparent Contact Angles Considering Gravity and Contact-Line EnergyJian Dong, Jie Wu, Wenbin Fu, et al.
Micromachines|October 27, 2026
Surface Roughness-Controlled Sinter-Bonding of Binder-Free Ag Preforms Consolidated Directly from Ag NanoparticlesHoi-Woon Lee, Jong-Hyun Lee
Micromachines|October 27, 2026
Fault Mechanism Analysis of MEMS Gyroscopes Under High-Overload EnvironmentBin Yan, Zhongyang Guo, Yilong Chen, et al.
Micromachines|October 27, 2026
Effects of Crosstalk Caused by Finite Extinction Ratio in Optical Time-Division Demultiplexer for PADCXin Chen, Meicheng Fu, Yi Zhang, et al.
Micromachines|October 27, 2026
Design, Modeling, and Performance Analysis of a 2D Non-Resonant Flexible Vibration-Assisted Polishing Device with a Series Large-Displacement Parallel MechanismXiaoming Zhang, Yan Gu, Bin Fu, et al.
Micromachines|October 27, 2026
Study on the Machining Characteristics of SiCp/Al Under Pulsed Laser-Ultrasonic Vibration-Assisted Composite TurningGuangze Du, Yan Gu, Bin Fu, et al.
Micromachines|October 27, 2026
Two-Dimensional Materials for Wide-Bandgap and Ultrawide-Bandgap Semiconductor Integration: Epitaxy, Interfaces, and Optoelectronic DevicesXitong Hong, Zhiqiang Xue, Mao Jia, et al.
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