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Science and Technology of Advanced Materials|August 19, 2026
Device engineering for photocurrent detected magnetic resonance and scanning probes using solid-state spin defectsHiroki Morishita, Naoya Morioka, Eikichi Kimura, et al.Science and Technology of Advanced Materials|November 7, 2022
Formation and thermal stability of two-phase microstructures in Al-containing refractory compositionally complex alloysStephan Laube, Alexander Kauffmann, Steven Schellert, et al.Science and Technology of Advanced Materials|November 7, 2022
CorrectionScience and Technology of Advanced Materials|February 5, 2025
Acquiring and transferring comprehensive catalyst knowledge through integrated high-throughput experimentation and automatic feature engineeringAya Fujiwara, Sunao Nakanowatari, Yohei Cho, et al.Science and Technology of Advanced Materials|February 5, 2025
Silver embedded porous carbon composite for high-performance lithium-metal anodeDong Ki Kim, Joo Hyeong Suh, Yoojin Hong, et al.Science and Technology of Advanced Materials|January 23, 2025
Integrating machine learning with advanced processing and characterization for polycrystalline materials: a methodology review and application to iron-based superconductorsAkiyasu Yamamoto, Akinori Yamanaka, Kazumasa Iida, et al.Science and Technology of Advanced Materials|December 10, 2024
Exploration and development of molecule-based printed electronics materials: an integrated approach using experimental, computational, and data sciencesTatsuo Hasegawa, Satoru Inoue, Seiji Tsuzuki, et al.Science and Technology of Advanced Materials|November 14, 2024
Recent progress on polymeric probes for formaldehyde sensing: a comprehensive reviewSubhadip Roy, Swagata Pan, Priyadarsi DeScience and Technology of Advanced Materials|November 19, 2024
Visualization of spatial inhomogeneity in the superconducting gap using micro-ARPESYudai Miyai, Shigeyuki Ishida, Kenichi Ozawa, et al.Science and Technology of Advanced Materials|November 19, 2024
Supra-ceramics: a molecule-driven frontier of inorganic materialsKazuhiko Maeda, Teruki Motohashi, Ryo Ohtani, et al.Pageof 149