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Science and Technology of Advanced Materials|November 24, 2016
Improvement in device performance from a mixture of a liquid crystal and photosensitive acrylic prepolymer with the photoinduced vertical alignment methodCzung-Yu Ho, Fa-Hsin Lin, Yu-Tai Tao, et al.Science and Technology of Advanced Materials|November 24, 2016
Sidewall GaAs tunnel junctions fabricated using molecular layer epitaxyTakeo Ohno, Yutaka OyamaScience and Technology of Advanced Materials|November 24, 2016
Transient charge-masking effect of applied voltage on electrospinning of pure chitosan nanofibers from aqueous solutionsDohiko Terada, Hisatoshi Kobayashi, Kun Zhang, et al.Science and Technology of Advanced Materials|November 24, 2016
Progress in thermomechanical control of steel plates and their commercializationKiyoshi Nishioka, Kazutoshi IchikawaScience and Technology of Advanced Materials|November 24, 2016
Patterning titania with the conventional and modified micromolding in capillaries technique from sol-gel and dispersion solutionsSajid Ullah Khan, Johan E Ten ElshofScience and Technology of Advanced Materials|November 24, 2016
Paclitaxel-loaded poly(lactide-co-glycolide)/poly(ethylene vinyl acetate) composite for stent coating by ultrasonic atomizing spraySoon Hong Yuk, Keun Sang Oh, Jinah Park, et al.Science and Technology of Advanced Materials|November 24, 2016
One-step route to a hybrid TiO2/Ti W1- N nanocomposite by in situ selective carbothermal nitridationZoë Schnepp, Martin J Hollamby, Masahiko Tanaka, et al.Science and Technology of Advanced Materials|November 24, 2016
Direct stamping of silver nanoparticles toward residue-free thick electrodeJiseok Kim, Kevin Wubs, Byeong-Soo Bae, et al.Science and Technology of Advanced Materials|November 24, 2016
Design and preparation of stress-free epitaxial BaTiO3 polydomain films by RF magnetron sputteringWei Zhang, Meiling Yuan, Xianyang Wang, et al.Science and Technology of Advanced Materials|November 24, 2016
Iron chalcogenide superconductors at high magnetic fieldsHechang Lei, Kefeng Wang, Rongwei Hu, et al.Pageof 149