Fangyuan Sun

4PUBLICATIONS
5CO-AUTHORS
Photovoltaic power systemsCompound semiconductorsComposite and hybrid materialsComputational methods in fluid flow, heat and mass transfer (incl. computational fluid dynamics)
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Publications (4)

|Jul 30, 2025
Direct Bonding of 6-in. SiC/Si Wafer with Enhanced Thermal Interface.

Szuyu Huang, Fachen Liu, Jiaxin Liu

|Apr 30, 2025
Direct Wafer Bonding of Silicon Carbide and Copper.

Szuyu Huang, Fachen Liu, Ruilin Mao

|Jul 05, 2023
Quantifying Interfacial Bonding Using Thermal Boundary Conductance at Cubic Boron Nitride/Copper Interfaces with a Large Mismatch of Phonon Density of States.

Naiqi Chen, Kunming Yang, Ziyang Wang

|Mar 16, 2023
Regulated Thermal Boundary Conductance between Copper and Diamond through Nanoscale Interfacial Rough Structures.

Ziyang Wang, Fangyuan Sun, Zihan Liu

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Frequent Collaborators

2 joint publications

Peng Gao

1 joint publications

Yanhui Feng

1 joint publications

Naiqi Chen

1 joint publications

Yue Liu