Jianbo Liang
3PUBLICATIONS
7CO-AUTHORS
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Publications (3)
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|Nov 14, 2023
High Thermal Stability and Low Thermal Resistance of Large Area GaN/3C-SiC/Diamond Junctions for Practical Device Processes.Ryo Kagawa, Zhe Cheng, Keisuke Kawamura
|Nov 23, 2022
High thermal conductivity in wafer-scale cubic silicon carbide crystals.Zhe Cheng, Jianbo Liang, Keisuke Kawamura
|Sep 09, 2021
Fabrication of GaN/Diamond Heterointerface and Interfacial Chemical Bonding State for Highly Efficient Device Design.Jianbo Liang, Ayaka Kobayashi, Yasuo Shimizu
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