Rúben F Santos
4PUBLICATIONS
7CO-AUTHORS
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Publications (4)
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|Jan 08, 2023
The Effect of Ultrasonic Agitation on the Seedless Growth of Cu on Ru-W Thin Films.Rúben F Santos, Bruno M C Oliveira, Paulo J Ferreira
|May 28, 2022
Co-W Barrier Layers for Metallization of Copper Interconnects: Thermal Performance Analysis.Bruno M C Oliveira, Ruben F Santos, Ana P Piedade
|Feb 15, 2022
Seedless Cu Electroplating on Ru-W Thin Films for Metallisation of Advanced Interconnects.Rúben F Santos, Bruno M C Oliveira, Liliane C G Savaris
|Aug 27, 2021
Seedless Cu Electroplating on Co-W Thin Films in Low pH Electrolyte: Early Stages of Formation.Rúben F Santos, Bruno M C Oliveira, Alexandre Chícharo
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