L A Menk

2PUBLICATIONS
4CO-AUTHORS
Electrical circuits and systems
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Publications (2)

|Oct 12, 2020
Bottom-Up Copper Filling of Millimeter Size Through Silicon Vias.

D Josell, L A Menk, A E Hollowell

|Oct 12, 2020
Bottom-Up Copper Filling of Large Scale Through Silicon Vias for MEMS Technology.

L A Menk, D Josell, T P Moffat

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Frequent Collaborators

2 joint publications

D Josell

2 joint publications

T P Moffat

2 joint publications

A E Hollowell

1 joint publications

P D Yeh