Meiling Xin

1PUBLICATIONS
1CO-AUTHORS
Structure and dynamics of materials
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Publications (1)

|Apr 16, 2024
Microstructure evolution, IMC growth, and microhardness of Cu, Ni, Ag-microalloyed Sn-5Sb/Cu solder joints under isothermal aging.

Meiling Xin, Xiuqi Wang, Fenglian Sun

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Xiuqi Wang