Wan-Chun Chuang
1PUBLICATIONS
0CO-AUTHORS
Get your video featured.
Publish with JoVEGet your video featured.
Publish with JoVE
Publications (1)
Sort by Publication Date:
|May 13, 2023
Exploring the Influence of Material Properties of Epoxy Molding Compound on Wafer Warpage in Fan-Out Wafer-Level Packaging.Wan-Chun Chuang, Yi Huang, Po-En Chen
Pageof 1
