Yong-Jun Kim

1PUBLICATIONS
2CO-AUTHORS
Circuits and systems
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Publications (1)

|Aug 26, 2022
Mechanical Characterization and Analysis of Different-Type Polyimide Feedthroughs Based on Tensile Test and FEM Simulation for an Implantable Package.

Seonho Seok, HyungDal Park, Yong-Jun Kim

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Frequent Collaborators

1 joint publications

Seonho Seok

1 joint publications

HyungDal Park