Junghwan Bang

3PUBLICATIONS
0CO-AUTHORS
Colloid and surface chemistryCatalysis and mechanisms of reactionsElemental semiconductors
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Publications (3)

|Feb 25, 2023
Thermo-Compression Bonding of Cu/SnAg Pillar Bumps with Electroless Palladium Immersion Gold (EPIG) Surface Finish.

So-Yeon Jun, Jung-Hwan Bang, Min-Su Kim

|Jun 02, 2021
Effect of Multiple Reflows on the Interfacial Reactions and Mechanical Properties of an Sn-0.5Cu-Al(Si) Solder and a Cu Substrate.

Junhyuk Son, Dong-Yurl Yu, Yun-Chan Kim

|Apr 30, 2021
Enhanced Thermo-Mechanical Reliability of Ultralow-K Dielectrics with Self-Organized Molecular Pores.

Y K Sa, Junghwan Bang, Junhyuk Son

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