William Anderson Lee Sanchez
2PUBLICATIONS
2CO-AUTHORS
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Publications (2)
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|Jul 27, 2022
Highly Thermally Conductive Epoxy Composites with AlN/BN Hybrid Filler as Underfill Encapsulation Material for Electronic Packaging.William Anderson Lee Sanchez, Jia-Wun Li, Hsien-Tang Chiu
|Jan 06, 2021
Enhanced Thermal Conductivity of Epoxy Composites Filled with Al2O3/Boron Nitride Hybrids for Underfill Encapsulation Materials.William Anderson Lee Sanchez, Chen-Yang Huang, Jian-Xun Chen
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