Ali Roshanghias
2PUBLICATIONS
1CO-AUTHORS
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Publications (2)
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|Apr 23, 2022
Glass Frit Jetting for Advanced Wafer-Level Hermetic Packaging.Ali Roshanghias, Jochen Bardong, Alfred Binder
|Jun 04, 2020
On the Feasibility of Fan-Out Wafer-Level Packaging of Capacitive Micromachined Ultrasound Transducers (CMUT) by Using Inkjet-Printed Redistribution Layers.Ali Roshanghias, Marc Dreissigacker, Christina Scherf
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