Jie Liang
3PUBLICATIONS
1CO-AUTHORS
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Publications (3)
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|Mar 27, 2026
An Analytical Modeling Study on the Thermal Behavior of Copper-Carbon Nanotube Composite Through-Silicon Via (TSV).Kai Ying, Jie Liang
|Oct 27, 2023
Direct Application of Carbon Nanotubes (CNTs) Grown by Chemical Vapor Deposition (CVD) for Integrated Circuits (ICs) Interconnection: Challenges and Developments.Zhenbang Chu, Baohui Xu, Jie Liang
|Jul 27, 2022
Recent Progress and Challenges Regarding Carbon Nanotube On-Chip Interconnects.Baohui Xu, Rongmei Chen, Jiuren Zhou
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