Ming-Yi Tsai

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0CO-AUTHORS
Computational methods in fluid flow, heat and mass transfer (incl. computational fluid dynamics)
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Publications (1)

|Apr 28, 2023
Measurements and Modelling of Thermally Induced Warpages of DIMM Socket Server PCB Assembly after Solder Reflow Processes.

Ming-Yi Tsai, Yu-Wen Wang, Yen-Jui Lu

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