Hongchao Ji

15PUBLICATIONS
6CO-AUTHORS
Metals and alloy materialsMicroelectronicsEnergy generation, conversion and storage (excl. chemical and electrical)Microelectromechanical systems (MEMS)Fluid-structure interaction and aeroacoustics
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Publications (15)

|Feb 13, 2026
Anand Model and Finite Element Analysis of Sn-0.3Ag-0.7Cu-3Bi Lead-Free Solder Joints in BGA Packages.

Junchen Liu, Abdullah Aziz Saad, Yuezong Zheng

|May 14, 2025
Finite Element Simulation and Optimization of Process Parameters for Titanium Chip Crusher.

Jianghua Huang, Zeling Zhao, Xiaomin Huang

|Apr 09, 2024
Effects of C and Al Alloying on Constitutive Model Parameters and Hot Deformation Behavior of Medium-Mn Steels.

Guangshun Guo, Mingming Wang, Hongchao Ji

|Mar 29, 2023
Effect of Free Cross-Linking Rate on the Molding of Bulk SiOC Ceramics.

Lei Zheng, Weilian Sun, Zhijian Ma

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