Meng-Kai Shih

1PUBLICATIONS
0CO-AUTHORS
Formal methods for software
Featured researcher

Get your video featured.

JoVEPublish with JoVE
Journal

Publications (1)

|Jun 28, 2023
Reliability Evaluation of Board-Level Flip-Chip Package under Coupled Mechanical Compression and Thermal Cycling Test Conditions.

Meng-Kai Shih, Yu-Hao Liu, Calvin Lee

Pageof 1

Frequent Collaborators