Joontaek Jung
2PUBLICATIONS
2CO-AUTHORS
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Publications (2)
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|Feb 25, 2023
Development and Characterization of Low Temperature Wafer-Level Vacuum Packaging Using Cu-Sn Bonding and Nanomultilayer Getter.Taehyun Kim, Sangwug Han, Jubum Lee
|Jul 28, 2022
FPCB as an Acoustic Matching Layer for 1D Linear Ultrasound Transducer Arrays.Taemin Lee, Joontaek Jung, Sang-Mok Lee
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