Zhuo Chen
2PUBLICATIONS
2CO-AUTHORS
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Publications (2)
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|May 25, 2024
Impact of Hydrogen Voiding in Chip-to-Chip Electroless All-Copper Interconnections.Nana Ren, Yuyi Zhang, Wenlong Shu
|Feb 25, 2022
Characteristics of Cracking Failure in Microbump Joints for 3D Chip-on-Chip Interconnections under Drop Impact.Zhen Liu, Mingang Fang, Lei Shi
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