Wen Huang

4PUBLICATIONS
31CO-AUTHORS
Circuits and systemsEngineering electromagneticsFunctional materialsMechatronics hardware design and architecture
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Publications (4)

|Nov 18, 2025
High inductance density in CMOS-compatible magnetically integrated 3D microinductors for radio-frequency applications.

Li Chen, Zhiyuan Qiao, Shengbao Liu

|Mar 14, 2025
Wafer-scale platform for on-chip 3D radio frequency lumped passive components using metal self-rolled-up membrane technique.

Zhikun Zhou, Zihan Zhang, Hanlin Zhang

|Aug 25, 2020
Geometrically reconfigurable 3D mesostructures and electromagnetic devices through a rational bottom-up design strategy.

Ke Bai, Xu Cheng, Zhaoguo Xue

|Feb 04, 2020
Monolithic mtesla-level magnetic induction by self-rolled-up membrane technology.

Wen Huang, Zhendong Yang, Mark D Kraman

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Frequent Collaborators

2 joint publications

Lei Sang

1 joint publications

Zhendong Yang

1 joint publications

Mark D Kraman

1 joint publications

Qingyi Wang