Xianhua Huan
2PUBLICATIONS
5CO-AUTHORS

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Publications (2)
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|Nov 13, 2025
Tailored Interfacial sp2/sp3 Hybridization in Diamond@DLC Heterostructure: Resolving the Microwave Absorption-Dielectric-Thermal Trilemma in Epoxy Composites for Electronic Packaging.Zhicheng Wu, Qingzhe Zhu, Zhijun Ai
|Jul 23, 2024
In situ interfacial evaluation of aramid/epoxy composites by interfacial stress transfer characteristics.Zhicheng Wu, Ruitao Ma, Zhijun Ai
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