Chunjian Shen
2PUBLICATIONS
0CO-AUTHORS
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Publications (2)
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|Oct 14, 2023
A Nickel Dissolution Process for Multilayer Electroforming to Achieve Ultrahigh Adhesion Strength.Zhuangzhuang Wang, Chunjian Shen, Zhou Ma
|Dec 23, 2022
Study of Copper Electrodeposition at a Very Low Temperature near the Freezing Point of Electrolyte.Yu Mo, Chunjian Shen, Di Zhu
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