Shien-Ping Feng
28PUBLICATIONS
74CO-AUTHORS
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Publications (28)
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|Mar 07, 2026
In-situ recomposition of polyethyleneimine additive enables a multiprocess long-lifetime thermocell.Xinya Wu, Chunlin Pang, Qikai Li
|Jan 05, 2026
Interface Engineering Suppresses Self-Annealing in Electroplated Nanograined Copper for Low-Temperature Copper-to-Copper Bonding.Gangqiang Peng, Xinyi Dong, Binzhao Li
|Dec 06, 2025
Nanoprinting with Crystal Engineering for Perovskite Lasers.Shiqi Hu, Ting Wang, Zhiwen Zhou
|Sep 29, 2025
Temperature adaptive self-regenerating ionic thermoelectric cycles for time domain thermal energy harvesting.Qikai Li, Mao Yu, Chunlin Pang
|Jul 21, 2025
Nanograin-Twin-Nanograin Alternating Composite Structure Enable Improved Cross-Interface Cu─Cu Bonding at Low Thermal Budgets.Cong Chen, Helios Y Li, Gangqiang Peng
|Jul 12, 2025
Metastable Nanocrystalline Copper for Effective Copper-to-Copper Bonding.Chuan He, Kaiyu Mu, Jingzhuo Zhou
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Frequent Collaborators
4 joint publications
Ji Tae Kim
3 joint publications
Jinwei Gao
2 joint publications
Junming Liu
2 joint publications
Hao Guo
2 joint publications
Chuyang Y Tang
2 joint publications
Yang Lu
2 joint publications
Baoling Huang
2 joint publications
Chuan He
2 joint publications
Weishu Liu
2 joint publications
Sijia Wang
