Chao-Hong Wang

4PUBLICATIONS
0CO-AUTHORS
Metals and alloy materialsElemental semiconductors
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Publications (4)

|Oct 16, 2026
Microstructural Evolution in Solid-State Sn-Zn/Ag/Cu Interfacial Reactions at 170 °C.

|Feb 13, 2026
Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.

Chao-Hong Wang, Chu-An Li, Kuan-Ting Li

|Jun 27, 2025
Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys.

Chao-Hong Wang, Che-Yang Lin

|May 11, 2024
Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material.

Chao-Hong Wang, Chun-Wei Chiu, Mei-Hau Li

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