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Chao-Hong Wang

3PUBLICATIONS
0CO-AUTHORS
Metals and alloy materialsElemental semiconductors
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Publications (3)

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|Feb 13, 2026
Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.

Chao-Hong Wang, Chu-An Li, Kuan-Ting Li

|Jun 27, 2025
Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys.

Chao-Hong Wang, Che-Yang Lin

|May 11, 2024
Interfacial Reactions between Sn-Based Solders and n-Type Bi<sub>2</sub>(Te,Se)<sub>3</sub> Thermoelectric Material.

Chao-Hong Wang, Chun-Wei Chiu, Mei-Hau Li

Pageof 1

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