Chao-Hong Wang
3PUBLICATIONS
0CO-AUTHORS
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Publications (3)
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|Feb 13, 2026
Influence of Pd Coating Thickness and Pd Content in Sn-Based Solders on Interfacial IMC Formation and Microstructural Evolution in Solder/Ni Joints.Chao-Hong Wang, Chu-An Li, Kuan-Ting Li
|Jun 27, 2025
Interfacial Behavior During Reactions Between Sn and Electroplated Co-Zn Alloys.Chao-Hong Wang, Che-Yang Lin
|May 11, 2024
Interfacial Reactions between Sn-Based Solders and n-Type Bi2(Te,Se)3 Thermoelectric Material.Chao-Hong Wang, Chun-Wei Chiu, Mei-Hau Li
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