Chun-Hsiung Lin
3PUBLICATIONS
2CO-AUTHORS
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Publications (3)
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|May 13, 2023
Effect of High-Pressure GaN Nucleation Layer on the Performance of AlGaN/GaN HEMTs on Si Substrate.You-Chen Weng, Ming-Yao Hsiao, Chun-Hsiung Lin
|Mar 29, 2023
Thermal Analysis of Flip-Chip Bonding Designs for GaN Power HEMTs with an On-Chip Heat-Spreading Layer.Kuo-Bin Hong, Chun-Yen Peng, Wei-Cheng Lin
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