Hemanth Kumar Cheemalamarri

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Electrometallurgy

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Publications (1)

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|Apr 08, 2026

Void-free Cu/dielectric hybrid bonding at low-temperature enabled by ultrathin metal passivation engineering for 3D-IC applications.

Hemanth Kumar Cheemalamarri, Masahisa Fujino, Tanmay Ghosh

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