Wolfgang Verestek
2PUBLICATIONS
3CO-AUTHORS
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Publications (2)
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|Sep 28, 2021
Characterization of Cure Behavior in Epoxy Using Molecular Dynamics Simulation Compared with Dielectric Analysis and DSC.Shuang Yan, Wolfgang Verestek, Harald Zeizinger
|May 05, 2021
Molecular Dynamics Simulation of High-Temperature Creep Behavior of Nickel Polycrystalline Nanopillars.Xiang Xu, Peter Binkele, Wolfgang Verestek
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