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Min Zhang

1PUBLICATIONS

1CO-AUTHORS

Fluid-structure interaction and aeroacoustics

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Publications (1)

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|Jan 08, 2023

Correlations between Microstructure and Residual Stress of Nanoscale Depth Profiles for TSV-Cu/TiW/SiO<sub>2</sub>/Si Interfaces after Different Thermal Loading.

Min Zhang, Fangzhou Chen, Fei Qin

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Yanwei Dai

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1 joint publications

Yanwei Dai

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