Yongkun Wang
2PUBLICATIONS
2CO-AUTHORS
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Publications (2)
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|Apr 27, 2024
Research on the Reliability of Advanced Packaging under Multi-Field Coupling: A Review.Yongkun Wang, Haozheng Liu, Linghua Huo
|Jun 07, 2022
A carbon nanosphere nanofluid for improving the toughness and thermal properties of epoxy composites.Peipei Li, Danyao Qu, Lu Zhang
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