Mingming Yi
2PUBLICATIONS
1CO-AUTHORS
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Publications (2)
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|Mar 26, 2025
Enhanced bonding intensity between the vertically aligned carbon fiber thermal interface material and heat spreader of a flip-chip package through a silane coupling agent.Mingming Yi, Oufei Liu, Jing Wen
|Jan 11, 2022
A Novel Method to Prepare Transparent, Flexible and Thermally Conductive Polyethylene/Boron Nitride Films.Mingming Yi, Meng Han, Junlin Chen
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