Juyana A Wahab

1PUBLICATIONS
3CO-AUTHORS
Electrometallurgy
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Publications (1)

|Jan 08, 2023
Effectiveness of Dimple Microtextured Copper Substrate on Performance of Sn-0.7Cu Solder Alloy.

Siti Faqihah Roduan, Juyana A Wahab, Mohd Arif Anuar Mohd Salleh

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Frequent Collaborators

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Andrei Victor Sandu

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Mădălina Simona Baltatu

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Petrica Vizureanu