Takanobu Watanabe

1PUBLICATIONS
3CO-AUTHORS
Circuits and systems
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Publications (1)

|Jan 31, 2022
Modification and Characterization of Interfacial Bonding for Thermal Management of Ruthenium Interconnects in Next-Generation Very-Large-Scale Integration Circuits.

Tianzhuo Zhan, Keita Sahara, Haruki Takeuchi

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Frequent Collaborators

1 joint publications

Tianzhuo Zhan

1 joint publications

Yen-Ju Wu

1 joint publications

Yibin Xu