Jongwon Lee
2PUBLICATIONS
1CO-AUTHORS
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Publications (2)
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|Jul 27, 2022
Implementation of Flip-Chip Microbump Bonding between InP and SiC Substrates for Millimeter-Wave Applications.Jongwon Lee, Jae Yong Lee, Jonghyun Song
|Jan 20, 2021
Sidewall Slope Control of InP Via Holes for 3D Integration.Jongwon Lee, Kilsun Roh, Sung-Kyu Lim
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