T M Braun
3PUBLICATIONS
2CO-AUTHORS
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Publications (3)
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|Nov 23, 2020
Simulation of Copper Electrodeposition in Through-Hole Vias.T M Braun, D Josell, J John
|Oct 08, 2020
Effect of Chloride Concentration on Copper Deposition in Through Silicon Vias.T M Braun, D Josell, M Silva
|Oct 08, 2020
Superconformal Nickel Deposition in Through Silicon Vias: Experiment and Prediction.T M Braun, S-H Kim, H-J Lee
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