Ole Hölck
2PUBLICATIONS
3CO-AUTHORS
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Publications (2)
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|Apr 23, 2022
Thin Film Encapsulation for LCP-Based Flexible Bioelectronic Implants: Comparison of Different Coating Materials Using Test Methodologies for Life-Time Estimation.Anna Pak, Kambiz Nanbakhsh, Ole Hölck
|Jun 02, 2021
Cure Kinetics Modeling of a High Glass Transition Temperature Epoxy Molding Compound (EMC) Based on Inline Dielectric Analysis.Erick Franieck, Martin Fleischmann, Ole Hölck
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