Wyatt Hodges

2PUBLICATIONS
4CO-AUTHORS
CeramicsMicroelectronics
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Publications (2)

|Feb 19, 2024
Thermal Transport and Mechanical Stress Mapping of a Compression Bonded GaN/Diamond Interface for Vertical Power Devices.

William Delmas, Amun Jarzembski, Matthew Bahr

|Jan 09, 2024
Inversion for Thermal Properties with Frequency Domain Thermoreflectance.

Benjamin Treweek, Volkan Akcelik, Wyatt Hodges

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