Chenxi Wang
10PUBLICATIONS
7CO-AUTHORS
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Publications (10)
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|Feb 05, 2026
Low-Temperature Ru-Ru Hybrid Bonding: Ar/H2 Plasma and NH4OH Synergistic Activation for Ultrahigh Density Interconnection.Yufei Bai, Jia Yang, Xinze Li
|Aug 01, 2025
Low-Temperature In Situ Bonding with Ion-Free Neutral Species and Ammonia-Enhanced Activation for Microfluidic Chip Architecture.Xiaohui Yuan, Linjie Liu, Fanfan Niu
|Mar 14, 2025
Synergistic Plasma Activation-Enabled Low-Temperature Cobalt/SiO2 Hybrid Bonding without Oxide Interfaces.Xiaoyun Qi, Yufei Bai, Han Yan
|Nov 08, 2024
Asymmetric Proton-Exchange-Enhanced Lithium Niobate and Silicon Low-Temperature Direct Bonding with an Ultrathin Heterogeneous Interface.Yu Du, Yuanshu Zou, Bingxuan Zhu
|Aug 28, 2024
InP/LiNbO3 Covalent Heterointerface Construction via an Asymmetric Plasma Activation Strategy for Hybrid Integrated Quantum Systems.Qiushi Kang, Han Yan, Fanfan Niu
|May 22, 2023
Room-temperature bonding of glass chips via PTFE-assisted plasma modification for nanofluidic applications.Qiushi Kang, Chenxi Wang, Kaimeng Liu
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