Shaili Falina
8PUBLICATIONS
12CO-AUTHORS
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Publications (8)
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|Apr 26, 2025
Correction: Arshad et al. A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties. Micromachines 2022, 13, 1513.Khairul Mohd Arshad, Muhamad Mat Noor, Asrulnizam Abd Manaf
|Feb 25, 2023
Status and Prospects of Heterojunction-Based HEMT for Next-Generation Biosensors.Najihah Fauzi, Rahil Izzati Mohd Asri, Mohamad Faiz Mohamed Omar
|Dec 23, 2022
Challenges and Opportunities for High-Power and High-Frequency AlGaN/GaN High-Electron-Mobility Transistor (HEMT) Applications: A Review.Muhaimin Haziq, Shaili Falina, Asrulnizam Abd Manaf
|Dec 11, 2022
Two-Dimensional Non-Carbon Materials-Based Electrochemical Printed Sensors: An Updated Review.Shaili Falina, Khairu Anuar, Saiful Arifin Shafiee
|Sep 23, 2022
A Comparative Modelling Study of New Robust Packaging Technology 1 mm2 VCSEL Packages and Their Mechanical Stress Properties.Khairul Mohd Arshad, Muhamad Mat Noor, Asrulnizam Abd Manaf
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Frequent Collaborators
8 joint publications
Mohd Syamsul Nasyriq Samsol Baharin
5 joint publications
Asrulnizam Abd Manaf
2 joint publications
Muhamad Mat Noor
1 joint publications
Masafumi Inaba
1 joint publications
Mohamed Fauzi Packeer Mohamed
1 joint publications
Mohamad Faiz Mohamed Omar
1 joint publications
Muhammad Firdaus Akbar Jalaludin Khan
1 joint publications
Nor Azlin Ghazali
1 joint publications
Mohd Hendra Hairi
1 joint publications
Khairu Anuar
