Chaojun Li

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0CO-AUTHORS
Resources engineering and extractive metallurgy not elsewhere classified
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Publications (1)

|Oct 10, 2020
The Microstructure, Thermal, and Mechanical Properties of Sn-3.0Ag-0.5Cu-xSb High-Temperature Lead-Free Solder.

Chaojun Li, Yanfu Yan, Tingting Gao

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