Kuo-Ning Chiang

6PUBLICATIONS
1CO-AUTHORS
Flexible manufacturing systemsNumerical modelling and mechanical characterisationArtificial life and complex adaptive systemsEconomic models and forecastingPower electronics
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Publications (6)

|Aug 27, 2026
A Mode-Aware Hybrid Machine-Learning Framework for Full-Field Warpage Prediction of Fan-Out Panel-Level Packaging After Debonding.

|Sep 13, 2025
Multi-Algorithm Ensemble Learning Framework for Predicting the Solder Joint Reliability of Wafer-Level Packaging.

Qinghua Su, Kuo-Ning Chiang

|Aug 29, 2024
A Small Database with an Adaptive Data Selection Method for Solder Joint Fatigue Life Prediction in Advanced Packaging.

Qinghua Su, Cadmus Yuan, Kuo-Ning Chiang

|Jul 29, 2023
Coefficient Extraction of SAC305 Solder Constitutive Equations Using Equation-Informed Neural Networks.

Cadmus Yuan, Qinghua Su, Kuo-Ning Chiang

|Jun 10, 2022
Predicting Wafer-Level Package Reliability Life Using Mixed Supervised and Unsupervised Machine Learning Algorithms.

Qing-Hua Su, Kuo-Ning Chiang

|Sep 28, 2021
An Overview of AI-Assisted Design-on-Simulation Technology for Reliability Life Prediction of Advanced Packaging.

Sunil Kumar Panigrahy, Yi-Chieh Tseng, Bo-Ruei Lai

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Frequent Collaborators

2 joint publications

Cadmus Yuan