Liyi Li

4PUBLICATIONS
1CO-AUTHORS
Polymers and plasticsCompound semiconductorsDental materials and equipment
Featured researcher

Get your video featured.

JoVEPublish with JoVE
Journal

Publications (4)

|May 27, 2026
A Comprehensive Experimental and Finite Element Analysis Study on the Bonding Strength Evaluation of Wafer-to-Wafer Hybrid Bonding with Polyimide Film Dielectrics.

|Dec 31, 2025
Study on Stress Distribution and Its Impact on Reliability of SiO2-Based Inorganic Chiplet Gap Filling.

Ziyang Ding, Shaowei Liu, Chen Lin

|Dec 31, 2025
Post-Bonding Crack-Induced Di-Cantilever Bending (PBC-DCB): A Novel Method for Quantitative Evaluation of Bonding Strength for Wafer-to-Wafer and Die-to-Wafer Hybrid Bonding.

Tianze Zheng, Yuan Xu, Cong Mei

|Dec 31, 2025
Analysis of Post-Bonding Crack-Induced Double Cantilever Bending (PDC-DCB) Method for Hybrid Bonding Strength Measurement.

Cong Mei, Tianze Zheng, Qiuhan Hu

Pageof 1

Frequent Collaborators

1 joint publications

Chen Lin