Daniel Treffer

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1CO-AUTHORS
Microtechnology
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Publications (1)

|Oct 29, 2020
Vacuum Compression Molding as a Screening Tool to Investigate Carrier Suitability for Hot-Melt Extrusion Formulations.

Gauri Shadambikar, Thomas Kipping, Nicole Di-Gallo

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Frequent Collaborators

1 joint publications

Michael A Repka